YAVNE, Israel, Nov 11, 2004 (BUSINESS WIRE) -- ORBOTECH LTD. (NASDAQ: ORBK) today announced the introduction of its new Paragon(TM) -8000 series of Laser Direct Imaging (LDI) systems for bare Printed Circuit Board (PCB) production.

Featuring field-proven Large Scan Optics (LSO) Technology(TM), Paragon-8000 offers a breakthrough combination of high LDI throughput and registration accuracy for superior imaging results on even the most complex high-density interconnect and packaging PCBs.

Commenting on the announcement, Mr. Asher Levy, President of the PCB Division at Orbotech Ltd., said: "We have leveraged the successful technology of our existing LDI solution to develop this powerful, next generation system that addresses the distinct requirements of the advanced, high technology segment of the market. Manufacturers can now take advantage of the outstanding benefits of LDI for their highly complex applications at excellent production-level throughput. We believe that with the new capabilities of Paragon, the mainstream use of LDI will now expand even further worldwide."

Paragon-8000 with LSO Technology delivers outstanding quality and accuracy - all at unmatched LDI throughput of up to 160 prints per hour. A real solution for today's very demanding registration challenges, Paragon-8000's sophisticated, "on-the-fly" CCD-based dynamic registration capability dramatically improves yields on advanced high-density interconnect, high layer count and packaging products, including intricate designs with fine features down to 25 um. Paragon-8000's dual resolution capabilities provide maximum flexibility to handle a wide range of jobs on the same system. It is also able to image on any type of UV-sensitive media, including dry and liquid resists.

Except for historical information, the matters discussed in this press release are forward-looking statements that are subject to certain risks and uncertainties which could cause the actual results to differ materially from those projected, including industry trends, the timing and strength of product and service offerings, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis and other risks detailed from time to time in the Company's SEC reports. The Company assumes no obligation to update the information in this press release.

Orbotech is a world leader in providing yield-enhancing, production support solutions for specialized applications in the supply chain of the electronics industry, principally for printed circuit boards (PCBs) and flat panel displays (FPDs). The Company designs, develops, manufactures, markets and services automated optical inspection (AOI) systems for bare and assembled PCBs and for FPDs, and imaging solutions for PCB production. The Company's innovative AOI, imaging and computer-aided manufacturing (CAM) technologies enable customers to achieve the increased yields and throughput essential to remaining at the forefront of electronics production. Through its subsidiary, Orbograph Ltd., the Company also develops and markets automatic check reading software to banks and other check processing organizations. Of Orbotech's employees, more than one quarter are scientists and engineers, who integrate their multi-disciplinary knowledge, talents and skills to develop and provide sophisticated solutions and technologies designed to meet customers' long-term needs. Orbotech maintains its headquarters and its primary research, development and manufacturing facilities in Israel, and more than 30 offices worldwide. The Company's extensive network of marketing, sales and customer support teams throughout North America, Europe, the Pacific Rim, China and Japan deliver its knowledge and expertise directly to customers the world over. For more information visit www.orbotech.com.

SOURCE: Orbotech Ltd.