<< Back
FEI Company Announces Additional Order for CLM-3D Metrology System for Semiconductor Fab Applications

HILLSBORO, Ore., Nov. 8 /PRNewswire-FirstCall/ -- FEI Company (Nasdaq: FEIC) announced that it has received a new order for its advanced CLM-3D(TM) metrology system in addition to the system that was sold during the third quarter of this year. These systems will be utilized by two major semiconductor manufacturers for use in development and implementation of next- generation manufacturing processes. The customers are leading designers and manufacturers of memory and logic chips.

"Our customers will utilize the CLM-3D systems for a range of applications in the development and production of 90-, 65- and 45- nanometer lithography, etch, deposition and CMP processes," said David Smith, vice president and general manager of FEI's Fab Products Division. "Customer feedback confirms that this system is delivering new and more valuable data between 3 and 7 times faster than traditional analysis methods, enabling them to develop and control new processes faster and more accurately than before. We believe adoption of CLM-3D systems will expand at these and other customers in 2005."

FEI's CLM-3D 300 mm DualBeam(TM) is an in-line, in-fab, full-wafer system for automated 3D metrology and analysis of latest generation semiconductor devices. It combines FEI's advanced electron column and high-current ion column technologies to provide high throughput cross-sectional metrology. The CLM-3D provides accurate cross sectioning and fully automated, high-resolution SEM image acquisition. FEI's proven IC3D metrology software extracts critical dimensions of surface and sub-surface structures for fast, precise process characterization.

About FEI:

FEI's Tools for Nanotech(TM) , featuring focused ion- and electron-beam technologies, deliver 3D characterization, analysis and modification capabilities with resolution down to the sub-Angstrom level. With R&D centers in North America and Europe and sales and service operations in more than 40 countries around the world, FEI is bringing the nanoscale within the grasp of leading researchers and manufacturers and helping to turn some of the biggest ideas of this century into reality. More information can be found on the FEI website at: http://www.feicompany.com .

Safe Harbor Statement

This news release contains forward-looking statements that include statements about potential future sales of CLM-3D systems. Factors that could affect these forward-looking statements include, but are not limited to order cancellation, the ongoing performance of FEI's tools at customer sites, acceptance of the tool, technology and applications by customers, performance of competitive products, the pace of development of next-generation processes in the semiconductor industry and the revenue growth and profitability of the semiconductor industry. Please also refer to our Form 10-K, Forms 10-Q and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update forward-looking statements.

SOURCE FEI Company
11/08/2004
CONTACT: Dan Zenka, APR, Corporate & Marketing Communications, 503-726-2695, or dzenka@feico.com, or Fletcher Chamberlin, Investor Relations, 503-726-7710, or fchamberlin@feico.com, both of FEI Company

Web site: http://www.feicompany.com
(FEIC)

11/08/2004 16:06 EST http://www.prnewswire.com

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Statements in this press release regarding FEI Company's business which are not historical facts are "forward-looking statements" that involve risks and uncertainties. For a discussion of such risks and uncertainties, which could cause actual results to differ from those contained in the forward-looking statements, see "Risk Factors" in the Company's Annual Report or Form 10-K for the most recently ended fiscal year.