|Hexion Inc. Introduces New Ultra-Low Emitting Cellobond™ Phenolic Resin for Composites|
COLUMBUS, Ohio - (March 14, 2017) - Hexion Inc. ("Hexion" or the "Company") is introducing a new phenolic resin for composites with an ultra-low free formaldehyde (ULEF) content of less than 0.1% at the JEC World 2017 International Composites Event in Paris.
The new, lower volatile organic compound (VOC) Cellobond™ J2027-X01 resin maintains the Cellobond product line's proven excellence in fire, smoke and toxicity (FST) performance while providing improved safe use and handling. The ULEF resin contains one-tenth the free formaldehyde of previous systems. This results in reduced emissions during composite manufacturing, particularly during open-mold processes such as hand lay-up while maintaining the reliable performance of phenolic resins.
"Phenolic composites are universally accepted as the best option for meeting the most stringent fire safety standards," said Ramesh Pisipati, Global Marketing Director for Hexion. "This enhanced Cellobond phenolic resin is easier to work with and mold, and its reduced emissions profile should be attractive to manufacturers who want the most reliable FST performance but have been uncertain about phenolics."
Manufacturers of composites for the transportation and aerospace industry are subject to strict FST regulations such as European Fire Safety Standard EN 45545-2. Hexion is the market leader in composite resins that help meet these standards for low flame spread, low smoke and toxicity.
A composite airplane seat back made from the new low-emitting Cellobond resin, utilizing a prepreg process, will be on display at JEC. For more information, consult with Hexion - Hall 6, Booth G54 - during the JEC World 2017 event in Paris, March 14-16, or visit hexion.com/epoxyphenoliccomposites or hexion.com/contacts.
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