| 08/18/10 | | Q3FY10 Earnings Announcement |
| | 11/17/10 | | Q4FY10 Earnings Announcement |
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| | | Date | Title | | | 07/21/10 | Applied Materials Announces Restructuring of Energy and Environmental Solutions Segment| Conference Call Scheduled for 7:00 a.m. PDT
SANTA CLARA, Calif., Jul 21, 2010 (BUSINESS WIRE) --Applied Materials, Inc. (Nasdaq:AMAT) today announced plans to
restructure its Energy and Environmental Solutions (EES) segment to put
a primary emphasis on opportunities in crystalline silicon (c-Si) solar
and advanced energy, including light emitting diode (LED) technology.
Upon completion of the restructuring plan, annual operating expenses are
expected to... |
|  | | 07/13/10 | Applied Materials to Highlight Innovations for Enabling Future Electronic Devices in San Francisco This Week| SANTA CLARA, Calif., Jul 13, 2010 (BUSINESS WIRE) --Applied Materials, Inc. will showcase its leadership and innovation for
producing future generations of microchips and clean energy solutions at
the Semicon West 2010, Intersolar North America and ASMC1events in San Francisco this week.The company's show theme, Turning
Innovations into Industries,(TM) summarizes Applied's
legacy and future promise. Through continuous innovations, Applied has
transformed t... |
| | | 07/13/10 | NXP and Applied Materials Sign Comprehensive Service Contract| SANTA CLARA, Calif., Jul 13, 2010 (BUSINESS WIRE) --Applied Materials, Inc. today announced that it has signed a
comprehensive, five-year contract to service all Applied Materials chip
production equipment at NXP Semiconductor's facility in Nijmegen,
Holland. Through its flexible AppliedPerformance Serviceprogram, Applied will provide NXP
with committed system uptime for over 70 Applied Materials systems in
NXP's 8-inch wafer facility, at a low, predictabl... |
| | | 07/12/10 | Applied Materials Leads the Way to Enable TSV Interconnects for 3D Chip Stacking|
TSVs are a key driver of 3D chip packaging for future mobile
communications devices
Applied introduces latest innovation for TSV production with
Producer Avila system
Applied is first to integrate full portfolio of systems for
fabricating TSVs in 3D-ICs
SANTA CLARA, Calif., Jul 12, 2010 (BUSINESS WIRE) --Applied Materials, Inc. is leading the next technology inflection to
advance through-silicon via (TSV) technology for h... |
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| | | Social Responsibility Index Recognition |
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Contact Information
Applied Materials, Inc.
Investor Relations
3050 Bowers Avenue
M/S 2038
P.O. Box 58039
Santa Clara, CA
95054-3299, U.S.A.
E-mail:
Investor_Relations@amat.com
Phone: 1-408-748-5227
Fax: 1-408-563-4606
Pre-recorded Investor
Information: 1-800-882-0373
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